Bluefors and JPE Collaborate on Millikelvin Cryoprobing

Bluefors and JPE are collaborating in a joint research and development project to develop a cryogenic probe system that operates below 100 millikelvin and enables the testing of large sets of dies and complete wafers of quantum chips with up to 150mm wafer sizes.

This development responds to growing needs in quantum technology, where circuits, detectors, and electronics must operate at cryogenic temperatures. Today, progress in these fields is slowed by long characterization and testing cycles, as devices are typically evaluated as individually packaged dies—a process that can take up to a week per test.

The project combines Bluefors’ expertise in advanced cryogenics with JPE’s experience in ultra‑precise positioning in cryogenic environments to create a breakthrough approach to quantum chip characterization. The planned solution removes the need for packaging before testing and is expected to reduce throughput times by at least a factor of ten. By enabling measurements of whole wafers or tens of dies in a single cooldown cycle, the system will significantly increase characterization throughput while avoiding unnecessary packaging and wire bonding.

This acceleration supports researchers and developers in exploring new architectures, scaling up systems, and bringing quantum applications closer to real-world deployment. The project will contribute to advancing quantum chip testing capabilities and further support the strong technological foundation that Bluefors and JPE have established in their respective fields.

The project has received Horizon Europe research and innovation funding via the Eurostars-3 program.