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Cryogenic Wafer Prober

High Throughput Characterization System

Our Cryogenic Wafer Prober (CWP) is a unique system for wafer-level testing of cryogenic quantum devices, electronics, and detectors. 

Highlights
Technical Specifications
Options
Performance Graphs
Layout and Facility Requirements
Contact Sales

The Cryogenic Wafer Prober enables testing of cryogenic quantum devices, electronics, and detectors at temperatures below 2 K measured from the surface of the wafer. It also provides fast sample characterization, with a throughput up to 100 times faster than commonly used cryogenic chambers, and enables volume probing for up to 300 mm wafers. The system can be operated fully automatically. 

The Cryogenic Wafer Prober was developed together with AEM, who have long experience in building automated wafer-level test systems.

Product Highlights

1.0

Cryogenic Wafer Prober

High Throughput Characterization System

Speeds Up Development 

The Cryogenic Wafer Prober provides up to 100 times faster throughput in sample characterization than commonly used cryogenic chambers, speeding up the development of cryogenic quantum devices, electronics, and detectors.

Testing in Cryogenic Temperatures 

The system is capable of automatic wafer handling and measurement at temperatures below 2 K measured from the surface of the wafer. The system features Bluefors He and 4K Cryostat Inserts, providing stable and uniform wafer temperatures. 

Automated Wafer Handling and Measurement 

The Cryogenic Wafer Prober handles and measures wafers accurately and automatically with the help of sensor and camera systems.

Watch the video below to see an example of wafer handling and measurements carried out with our CWP system. 

Compatible with Bluefors Experimental Wiring 

The Cryogenic Wafer Prober is compatible with Bluefors experimental cryogenic wiring, which operates reliably in the cryogenic environment, induces a minimal thermal load, and offers low noise levels. 

Fully Custom Probe Cards 

The system offers fully custom Probe Cards and probing setups for RF and DC signals to meet different testing requirements. 

Temperature Controller 

The Bluefors Temperature Controller enhances the user experience of our cryogenic systems. With a modern and intuitive user interface, you enjoy direct control and a full overview of the temperature status of the system. The Bluefors Temperature Controller is fully integrated into the CWP system. 

Read more about the benefits of the Temperature Controller.

Technical Specifications

2.0

Cryogenic Wafer Prober

High Throughput Characterization System

Note: Base temperature is measured from the surface of the wafer.

Cryogenic Wafer Prober 
Wafer size 300 mm, 200 mm, and 150 mm 
Travel±160 mm XY, 0–40 mm Z, ± 4 ° Theta 
XY – Accuracy±20 µm
Travel speedUp to 35 mm/s XY, fully adjustable 
Wafer base temperature < 2 K  
Wafer exchange time (measurement-to-measurement)~ 3 h 
Wiring capacity Up to 768 single DC lines 
Up to 48 RF lines (either 18 GHz or 40 GHz operation) 
Wafer loading From FOUP / magazine or manually to load lock

Options

3.0

Cryogenic Wafer Prober

High Throughput Characterization System

The Autoloader is an optional part of the Cryogenic Wafer Prober system. It allows the system to be used fully automatically using a robotic arm. The Autoloader supports 150 mm, 200 mm, and 300 mm wafers. Wafers are placed in a wafer magazine for a handling robot to retrieve and place them into the load lock. The integrated Wafer Pre-Aligner makes sure that the wafer orientation is correct before the wafer is moved into the load lock.

Wafer Size Exchange Kits allow the system to be configured for different wafer sizes. With the adjustable configuration, probing can be carried out on the system with alternating wafer sizes. 

The Backplane Docking allows easier connection of Probe Cards to the Cryogenic Wafer Prober. With this option, probe cards can be slid into the backplane docking and the different connectors do not need to be manually connected. 

Performance Graphs

4.0

Cryogenic Wafer Prober

High Throughput Characterization System

Below are cooldown curves for the Cryogenic Wafer Prober, measured with calibrated resistance thermometers.

Layout and Facility Requirements

5.0

Cryogenic Wafer Prober

High Throughput Characterization System

Layout Overview

Overview of CWP System: 1. He Cryostat Insert, 2. 4K Cryostat Insert, 3. Loading Unit, 4 Control Unit (CU), 5. Pulse Tube Cooler (3 pcs.), 6. Movable service frame, 7. Autoloader (optional), 8. Vacuum Chamber, 9. Gas Handling System (GHS).

Each of our systems is designed to be installed at a specific location defined in advance. A separate layout drawing is made for each Bluefors system, which should always be referred to for exact dimensions. 

Facility Requirements

The basic requirements for our systems are 3-phase electricity, cooling water, and compressed air. The full list of requirements and specification details can be found in the Pre-Installation Guide. Please contact our sales team for a copy. 

See also

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