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Modular Cryogenic Platform
The Modular Cryogenic Platform is a scalable solution for the most demanding quantum applications, with the power and flexibility to take you far into the quantum future.
The Modular Cryogenic Platform takes a completely new approach to cryogenic system architecture. Designed to support the most demanding quantum computing applications, the system has been built to scale and expand with ever-growing industrial needs. Multiple individual modules can be combined to create a massive cooling architecture on an unprecedented scale, making previously unimagined qubit counts possible, all in a cost- and space-efficient design. It’s a quantum leap far into the future.
Expandable Quantum Infrastructure Platform
The scalable architecture of the Modular Cryogenic Platform enables easy upgrading and expansion, in a future-proof design that supports physical qubit counts in the hundreds of thousands.
Compact Footprint. Unlimited Possibilities.
The Modular Cryogenic Platform enables the easy expansion of cooling and cryogenic measurement infrastructure. Modules are available in two sizes (narrow and wide), and configurable with a number of cooling units or wiring inserts.
The design makes it possible to start with a smaller system of one module, and simply add more as compute needs increase.
If your cooling needs change over time, it’s also possible to just upgrade the cooling unit while the surrounding system architecture and wiring stays in place.
Built for Large-Scale Quantum Computing
The Modular Cryogenic Platform is essentially a vast, self-supported vacuum chamber, with full access doors on every side. When multiple modules are connected it’s possible to create a cavernous payload space spanning the entire system interior.
With each module supporting payloads up to 800 kg, the opportunities for large-scale quantum applications are unlimited.
The modular design also removes limits to measurement infrastructure. Modules can integrate up to 36 side-loading wiring ports that remain independent from the cooling architecture, so wiring and payload can easily be relocated or swapped out.
High Performance Integration
The Modular Cryogenic Platform was designed and optimized for High-Performance Computing (HPC) environments.
It features a low form factor that can be easily integrated into HPC centers, and the external visual appearance can be customized to meet customer requirements.
Each module utilizes a compact footprint so scaling up remains spatially efficient.
